Micrel, Inc.

SY88973BL

February 2007

11

M9999-020207-A

PCB Thermal Consideration for 16-Pin MLF® Package

(Always solder, or equivalent, the exposed pad to the PCB)

Package Notes:

1. Package meets Level 2 qualification.

2. All parts are dry-packaged before shipment.

3. Exposed pad must be soldered to a ground for proper thermal management;

solder void has to be less than 50% of the epad area.

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com

The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its

use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.

Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product

can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant

into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A

Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully

indemnify Micrel for any damages resulting from such use or sale.

© 2007 Micrel, Incorporated.