3

SY88923AV

Micrel, Inc.

M9999-110905

hbwhelp@micrel.com or (408) 955-1690

Power Supply Voltage (V

Input Voltage

(D

(/EN) ................................................................ 0V to V

CC

(LOS

Output Voltage (with 50

Ω load)

(D

(V

Lead Temperature (soldering, 20 sec.) ..................... 260

°C

Storage Temperature (T

Supply Voltage (V

Ambient Temperature (T

Package Thermal Resistance

MSOP

(θ

Still-Air ........................................................... 113

°C/W

EPAD-MSOP

(θ

Still-Air ............................................................. 38

°C/W

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Current

No output load

38

60

mA

35

53

mA

/EN Input LOW Current

–0.3

mA

/EN Input HIGH Current

20

µA

100

µA

Common Mode Range

GND +2.0

V

Differential Output Offset

±80

mV

V

LOS Output LOW Level

0.5

V

LOS Output Leakage

100

µA

Output HIGH Voltage

mV

Output LOW Voltage

mV

Reference Supply

V

–0.8

0.5

mA

/EN Input HIGH Voltage

2.0

V

/EN Input LOW Voltage

0.8

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended

periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established. The device is

tested in a socket such that transverse airflow of

≥500lfpm is maintained.