Micrel, Inc.

SY88313BL

February 2007

4

M9999-021207-B

Absolute Maximum Ratings

(1)

VREF Current............................................................ ±1mA

Lead Temperature (soldering, 20sec.) ................... +260°C

Operating Ratings

(2)

Junction Thermal Resistance

(3)

MLF

®

(

(

EPAD-MSOP

(

(

DC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Current

No output load.

47

65

mA

LOSLVL Voltage

V

CML Output HIGH Voltage

V

CML Output LOW Voltage

V

Differential Output Offset

±80

mV

Single-Ended Output Impedance

40

50

60

Ω

Single-Ended Input Impedance

40

50

60

Ω

Reference Voltage

V

TTL DC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

/EN Input HIGH Voltage

2.0

V

/EN Input LOW Voltage

0.8

V

/EN Input HIGH Current

20

100

µA

µA

/EN Input LOW Current

-0.3

mA

LOS Output HIGH Level

2.4

2.0

V

V

LOS Output LOW Level

0.5

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB.

uses 4-layer (