NLAS325

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10

PACKAGE DIMENSIONS

US8

US SUFFIX

CASE 493−02

ISSUE B

DIM

A

MIN

MAX

MIN

MAX

INCHES

1.90

2.10

0.075

0.083

MILLIMETERS

B

2.20

2.40

0.087

0.094

C

0.60

0.90

0.024

0.035

D

0.17

0.25

0.007

0.010

F

0.20

0.35

0.008

0.014

G

0.50 BSC

0.020 BSC

H

0.40 REF

0.016 REF

J

0.10

0.18

0.004

0.007

K

0.00

0.10

0.000

0.004

L

3.00

3.20

0.118

0.126

M

0

6

0

6

N

5

10

5

10

P

0.23

0.34

0.010

0.013

R

0.23

0.33

0.009

0.013

S

0.37

0.47

0.015

0.019

U

0.60

0.80

0.024

0.031

V

0.12 BSC

0.005 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR.

MOLD FLASH. PROTRUSION AND GATE

BURR SHALL NOT EXCEED 0.140 MM

(0.0055”) PER SIDE.

4. DIMENSION “B” DOES NOT INCLUDE

INTER−LEAD FLASH OR PROTRUSION.

INTER−LEAD FLASH AND PROTRUSION

SHALL NOT E3XCEED 0.140 (0.0055”) PER

SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203 MM.

(300−800 “).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED

±0.0508 (0.0002 “).

L

B

A

P

G

4

1

5

8

C

K

D

SEATING

J

S

R

U

DETAIL E

V

F

H

N

R 0.10 TYP

M

−Y−

−X−

−T−

DETAIL E

T

M

0.10 (0.004)

XY

T

0.10 (0.004)

__

__

__

__

PLANE

mm

inches

SCALE 8:1

3.8

0.15

0.50

0.0197

1.0

0.0394

0.30

0.012

1.8

0.07

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy

and soldering details, please download the

ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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NLAS325/D

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