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BYV97 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BYV97
Description  Fast soft-recovery controlled avalanche rectifiers
Download  9 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYV97 Datasheet(HTML) 2 Page - NXP Semiconductors

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1996 Jun 07
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYV97 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Available in ammo-pack.
DESCRIPTION
Rugged glass SOD57 package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of
expansion of all used parts are matched.
Fig.1 Simplified outline (SOD57) and symbol.
2/3 page (Datasheet)
MAM047
ka



LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
BYV97F
1200
V
BYV97G
1400
V
VR
continuous reverse voltage
BYV97F
1200
V
BYV97G
1400
V
IF(AV)
average forward current
Ttp =60 °C; lead length = 10 mm
see Fig.2;
averaged over any 20 ms period;
see also Fig.6
1.6
A
IF(AV)
average forward current
Tamb =50 °C; PCB mounting
(see Fig. 12); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
0.9
A
IFRM
repetitive peak forward current
Ttp =65 °C; see Fig.4
15
A
Tamb =65 °C; see Fig.5
8A
IFSM
non-repetitive peak forward current
t = 10 ms half sine wave;
Tj =Tj max prior to surge;
VR =VRRMmax
20
A
ERSM
non-repetitive peak reverse
avalanche energy
L = 120 mH; Tj =Tj max prior to
surge; inductive load switched off
10
mJ
Tstg
storage temperature
−65
+175
°C
Tj
junction temperature
see Fig.7
−65
+175
°C


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