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NCV7361A Datasheet(PDF) 20 Page - ON Semiconductor |
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NCV7361A Datasheet(HTML) 20 Page - ON Semiconductor |
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NCV7361A http://onsemi.com 20 Table 1. SO−8 Thermal RC Network Models* Copper Area (1 oz thick) 54 mm2 714 mm2 54 mm2 714 mm2 (SPICE Deck Format) Cauer Network Foster Network 54 mm2 714 mm2 Units Tau Tau Units C_C1 Junction GND 1.08E−05 1.08E−05 W−s/C 1.00E−06 1.00E−06 sec C_C2 node1 GND 4.10E−05 4.10E−05 W−s/C 1.00E−05 1.00E−05 sec C_C3 node2 GND 1.13E−04 1.13E−04 W−s/C 1.00E−04 1.00E−04 sec C_C4 node3 GND 4.42E−04 4.40E−04 W−s/C 5.00E−04 5.00E−04 sec C_C5 node4 GND 1.74E−03 1.71E−03 W−s/C 1.00E−03 1.00E−03 sec C_C6 node5 GND 1.39E−03 1.34E−03 W−s/C 1.00E−02 1.00E−02 sec C_C7 node6 GND 2.08E−02 1.78E−02 W−s/C 1.00E−01 1.00E−01 sec C_C8 node7 GND 1.08E−02 9.75E−03 W−s/C 1.00E+00 1.00E+00 sec C_C9 node8 GND 1.14E−01 1.84E−01 W−s/C 1.00E+01 1.00E+01 sec C_C10 node9 GND 8.11E−01 3.00E+00 W−s/C 5.00E+01 5.00E+01 sec R’s R’s R_R1 Junction node1 0.119 0.119 C/W 0.070 0.070 C/W R_R2 node1 node2 0.286 0.286 C/W 0.152 0.152 C/W R_R3 node2 node3 0.857 0.859 C/W 0.481 0.481 C/W R_R4 node3 node4 1.181 1.189 C/W 0.690 0.690 C/W R_R5 node4 node5 1.241 1.276 C/W 0.584 0.584 C/W R_R6 node5 node6 2.574 2.690 C/W 3.223 3.223 C/W R_R7 node6 node7 18.065 21.708 C/W 0.823 0.823 C/W R_R8 node7 node8 27.965 26.035 C/W 26.801 35.166 C/W R_R9 node8 node9 80.896 49.821 C/W 63.710 52.538 C/W R_R10 node9 GND 49.468 15.252 C/W 86.119 25.510 C/W *Bold face items in the tables above represent the package without the external thermal system. The Cauer networks generally have physical significance and may be divided between nodes to separate thermal behavior due to one portion of the network from another. The Foster networks, though when sorted by time constant (as above) bear a rough correlation with the Cauer networks, are really only convenient mathematical models. Cauer networks can be easily implemented using circuit simulating tools, whereas Foster networks may be more easily implemented using mathematical tools (for instance, in a spreadsheet program), according to the following formula: R(t) + n S i + 1 Ri 1−e −t taui Junction Ambient (thermal ground) R1 R2 C1 C2 C3 Cn Rn R3 Time constants are not simple RC products. Amplitudes of mathematical solution are not the resistance values. Figure 29. Grounded Capacitor Thermal Network (“Cauer” Ladder) Figure 30. Non−Grounded Capacitor Thermal Ladder (“Foster” Ladder) Junction Ambient (thermal ground) R1 R2 C1 C2 C3 Cn Rn R3 Each rung is exactly characterized by its RC−product time constant; Am- plitudes are the resistances |
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