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HSDL-3000 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard)

Part # HSDL-3000
Description  IrDA Data Compliant 115.2 kbps Infrared Transceiver
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSDL-3000 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard)

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11
1.2 Adjacent Land Keep-out and Solder Mask Areas
Dim.
mm
Inches
h
min. 0.40
min. 0.016
j
10.1
0.40
k
3.85
0.15
l
3.2
0.126
Figure 3. HSDL-3000#007/#017 PCBA – Adjacent land keep-out and solder mask.
• Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no
other SMD components within
this area.
• “h” is the minimum solder
resist strip width required to
avoid solder bridging adjacent
pads.
• It is recommended that 2
fiducial cross be placed at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
h
l
Tx LENS
Rx LENS
j
SOLDER
MASK
LAND
k
Y
X
2.0 Recommended Solder Paste/
Cream Volume for Castellation
Joints
The recommended printed solder
paste volume required per
castellation pad is 0.30 cubic mm
(based on either no-clean or
aqueous solder cream types with
typically 60 to 65% solid content
by volume).


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