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BCM2045 Datasheet(PDF) 1 Page - Broadcom Corporation.

Part No. BCM2045
Description  BLUTONIUM BLUETOOTH 2.0 EDR SINGLE-CHIP HCI SOLUTION
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Maker  BOARDCOM [Broadcom Corporation.]
Homepage  http://www.broadcom.com
Logo BOARDCOM - Broadcom Corporation.

BCM2045 Datasheet(HTML) 1 Page - Broadcom Corporation.

  BCM2045 Datasheet HTML 1Page - Broadcom Corporation. BCM2045 Datasheet HTML 2Page - Broadcom Corporation.  
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BCM2045
®
BLUTONIUM® BLUETOOTH® 2.0 + EDR SINGLE-CHIP HCI SOLUTION
Typical Cell Phone Application
World’s first Bluetooth 2.0 + EDR solution in 0.13 um CMOS
technology
Fully integrated balun and T/R switch eliminates all external
RF matching components
Supports class 1, 2, and 3 designs
Fully supports the Bluetooth 1.1, 1.2, and 2.0 standards
including 1, 2, and 3 Mbps EDR operation
Lowest current consumption in all modes of operation
ROM-based solution eliminates external flash and/or
EEPROM memory
Highest available Bluetooth radio performance of any single-
chip solution
• 88 dBm receiver sensitivity using EDR communication
• Programmable output power up to +7 dBm
Minimized external BOM requirements are less than 10
external passive components
Supports UART, USB, SDI, and SPI HCI transports
Fractional-N frequency synthesizer supports any crystal or
TCXO source from 12 to 40 MHz
Automatic calibration and frequency detection of crystal
frequency
Maximizes range and simplifies system integration by
providing exceptional output power and receiver sensitivity
High-level of integration eliminates challenges of board level
RF design
Achieves smallest board area requirements by minimal
external BOM and smallest package size available today
• Standard PCB requirement is less than 50 mm^2
• Module solutions less than 25 mm^2
ROM-based solution with flexible code patching ensures fast
integration
On-chip voltage regulator lowers BOM requirements and
provides additional power savings capability
Minimized power dissipation over other solutions
• 50% savings in power in standard telephony headset
applications
• 30% savings in power in advanced stereo audio applications
Cellular and mobile communication devices
PDA and low-power embedded communication devices
PC and integration on PC mother board applications
Package types available
• 95-pin fpBGA package (6 mm x 6 mm)
• 65-pin fpBGA package (5 mm x 5 mm)
• Wafer scale flip chip packaging
FE A T UR E S
SU MM AR Y O F B E N E FI TS
AP P L IC AT IO N S
XTAL_IN
XTAL_PD/PU
LPO_INPUT
HOST_WAKE
BT_WAKE
UART
PCM
BCM2045
TCXO
LPO Clock
Handset
Baseband
Voice Codec


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