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NCV4269 Datasheet(PDF) 3 Page - ON Semiconductor

Part No. NCV4269
Description  5.0 V Micropower 150 mA LDO Linear Regulator with DELAY, Adjustable RESET, and Sense Output
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NCV4269 Datasheet(HTML) 3 Page - ON Semiconductor

 
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NCV4269
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MAXIMUM RATINGS (TJ = −40°C to 150°C)
Parameter
Symbol
Min
Max
Unit
Input to Regulator
VI
II
−40
Internally Limited
45
Internally Limited
V
Input Transient to Regulator
VI
60
V
Sense Input
VSI
ISI
−40
−1
45
1
V
mA
Reset Threshold Adjust
VRADJ
IRADJ
−0.3
−10
7
10
V
mA
Reset Delay
VD
ID
−0.3
Internally Limited
7
Internally Limited
V
Ground
Iq
50
mA
Reset Output
VRO
IRO
−0.3
Internally Limited
7
Internally Limited
V
Sense Output
VSO
ISO
−0.3
Internally Limited
7
Internally Limited
V
Regulated Output
VQ
IQ
−0.5
−10
7.0
V
mA
Junction Temperature
Storage Temperature
TJ
TSTG
−50
150
150
°C
°C
Input Voltage Operating Range
Junction Temperature Operating Range
VI
TJ
−40
45
150
V
°C
Lead Temperature Soldering and MSL
Parameter
Symbol
Value
MSL, 20−Lead LS Temperature 265
°C Peak (Note 3)
MSL
3
MSL, 20−Lead, LS Temperature 240
°C Peak (Note 4)
MSL
1
MSL, 8−Lead, 14−Lead, LS Temperature 265
°C Peak (Note 3)
MSL
1
MSL, 8−Lead EP, LS Temperature 260
°C
MSL
2
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series incorporates ESD protection and exceeds the following ratings:
Human Body Model (HBM)
≤ 2.0 kV per JEDEC standard: JESD22–A114.
Machine Model (MM)
≤ 200 V per JEDEC standard: JESD22–A115.
2. Latchup Current Maximum Rating:
≤ 150 mA per JEDEC standard: JESD78.
3. +5
°C/−0°C, 40 Sec Max−at−Peak, 60 − 150 Sec above 217°C.
4. +5
°C/−0°C, 30 Sec Max−at−Peak, 60 − 150 Sec above 183°C.
THERMAL CHARACTERISTICS
Characteristic
Test Conditions (Typical Values)
Unit
SO−8 Package (Note 5)
Junction−to−Pin 4 (
Y − JL4, YL4)
53.8
°C/W
Junction−to−Ambient Thermal Resistance (RqJA, qJA)
170.9
°C/W
SO−8 EP Package (Note 5)
Junction−to−Pin 8 (
Y − JL8, YL8)
23.7
°C/W
Junction−to−Ambient Thermal Resistance (RqJA, qJA)
71.4
°C/W
Junction−to−Pad (
Y − JPad)
7.7
°C/W
SO−14 Package (Note 5)
Junction−to−Pin 4 (
Y − JL4, YL4)
18.4
°C/W
Junction−to−Ambient Thermal Resistance (RqJA, qJA)
111.6
°C/W
SO−20 Package (Note 5)
Junction−to−Pin 4 (
Y − JL4, YL4)
21.8
°C/W
Junction−to−Ambient Thermal Resistance (RqJA, qJA)
95.3
°C/W
5. 2 oz copper, 50 mm2 copper area, 1.5 mm thick FR4


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