NCP583

http://onsemi.com

9

PACKAGE DIMENSIONS

SOT−563

XV SUFFIX

CASE 463A−01

ISSUE F

1.35

0.0531

0.5

0.0197

mm

inches

SCALE 20:1

0.5

0.0197

1.0

0.0394

0.45

0.0177

0.3

0.0118

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.50

0.55

0.60

b

0.17

0.22

0.27

C

D

1.50

1.60

1.70

E

1.10

1.20

1.30

e

0.5 BSC

L

0.10

0.20

0.30

1.50

1.60

1.70

0.020

0.021

0.023

0.007

0.009

0.011

0.059

0.062

0.066

0.043

0.047

0.051

0.02 BSC

0.004

0.008

0.012

0.059

0.062

0.066

MIN

NOM

MAX

INCHES

e

M

0.08 (0.003)

X

A

C

−X−

−Y−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE MATERIAL.

D

E

Y

12

3

4

5

L

6

0.08

0.12

0.18

0.003

0.005

0.007