NCP302, NCP303

http://onsemi.com

26

PACKAGE DIMENSIONS

0.7

0.028

1.0

0.039

mm

inches

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

TSOP−5/THIN SOT−23−5/SC59−5

CASE 483−02

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. A AND B DIMENSIONS DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

2.90

3.10

0.1142

0.1220

B

1.30

1.70

0.0512

0.0669

C

0.90

1.10

0.0354

0.0433

D

0.25

0.50

0.0098

0.0197

G

0.85

1.05

0.0335

0.0413

H

0.013

0.100

0.0005

0.0040

J

0.10

0.26

0.0040

0.0102

K

0.20

0.60

0.0079

0.0236

L

1.25

1.55

0.0493

0.0610

M

0

10

0

10

S

2.50

3.00

0.0985

0.1181

0.05 (0.002)

12

3

54

S

A

G

L

B

D

H

C

K

M

J

__

_

_

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