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BYG60M Datasheet(PDF) 4 Page - NXP Semiconductors |
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BYG60M Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 6 page 1996 Jun 05 4 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYG60 series GRAPHICAL DATA Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). VR =VRRMmax; δ = 0.5; a = 1.57. handbook, halfpage 0 200 4 IF(AV) (A) 3 1 0 2 MGD481 100 Ttp (°C) Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). VR =VRRMmax; δ = 0.5; a = 1.57 Device mounted as shown in Fig.7; solid line: Al2O3 PCB; dotted line: epoxy PCB. handbook, halfpage 0 200 1.6 IF(AV) (A) 1.2 0.4 0 0.8 MGD482 100 Tamb (°C) Device mounted as shown in Fig.7 Solid line: Al2O3 PCB Dotted line: epoxy PCB. Fig.4 Maximum permissible junction temperature as a function of reverse voltage. handbook, halfpage 200 Tj ( °C) 0 400 1200 0 MGD483 800 VR (V) 40 DG J K M 80 120 160 Solid line: Tj =25 °C. Dotted line: Tj = 175 °C. Fig.5 Forward current as a function of forward voltage; maximum values. handbook, halfpage 012 VF (V) 3 10 IF (A) 0 8 MGD484 6 4 2 |
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Similar Description - BYG60M |
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