NBSG16VS

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4

Table 3. ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistor (D, D)

75 k

W

Internal Input Pullup Resistor (D)

36.5 k

W

ESD Protection

Human Body Model

Machine Model

> 2 kV

> 100 V

Moisture Sensitivity (Note 4)

Pb Pkg

Pb−Free Pkg

FCBGA−16

QFN−16

Level 3

Level 1

N/A

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

192

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

4. For additional information, see Application Note AND8003/D.

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

Positive Power Supply

3.6

V

Negative Power Supply

−3.6

V

Positive Input

Negative Input

3.6

−3.6

V

V

Differential Input Voltage

|D − D|

2.8

V

V

Output Current

Continuous

Surge

25

50

mA

mA

Static

Surge

45

80

mA

mA

1

mA

1

mA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

(Note 5)

0 lfpm

500 lfpm

0 lfpm

500 lfpm

16 FCBGA

16 FCBGA

16 QFN

16 QFN

108

86

41.6

35.2

°C/W

°C/W

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

2S2P (Note 5)

2S2P (Note 6)

16 FCBGA

16 QFN

5.0

4.0

°C/W

°C/W

Wave Solder

Pb

Pb−Free

225

225

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

5. JEDEC standard 51−6 multilayer board − 2S2P (2 signal, 2 power).

6. JEDEC standards multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.