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NBSG16VSBAR2 Datasheet(PDF) 4 Page - ON Semiconductor |
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NBSG16VSBAR2 Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 14 page NBSG16VS http://onsemi.com 4 Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor (D, D) 75 k W Internal Input Pullup Resistor (D) 36.5 k W ESD Protection Human Body Model Machine Model > 2 kV > 100 V Moisture Sensitivity (Note 4) Pb Pkg Pb−Free Pkg FCBGA−16 QFN−16 Level 3 Level 1 N/A Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 192 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 4. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC Positive Power Supply VEE = 0 V 3.6 V VEE Negative Power Supply VCC = 0 V −3.6 V VI Positive Input Negative Input VEE = 0 V VCC = 0 V VI v VCC VI w VEE 3.6 −3.6 V V VINPP Differential Input Voltage |D − D| VCC − VEE w 2.8 V VCC − VEE t 2.8 V 2.8 |VCC − VEE| V V IOUT Output Current Continuous Surge 25 50 mA mA IIN Input Current Through RT (50 W Resistor) Static Surge 45 80 mA mA IBB VBB Sink/Source 1 mA IMM VMM Sink/Source 1 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) (Note 5) 0 lfpm 500 lfpm 0 lfpm 500 lfpm 16 FCBGA 16 FCBGA 16 QFN 16 QFN 108 86 41.6 35.2 °C/W °C/W °C/W °C/W qJC Thermal Resistance (Junction−to−Case) 2S2P (Note 5) 2S2P (Note 6) 16 FCBGA 16 QFN 5.0 4.0 °C/W °C/W Tsol Wave Solder Pb Pb−Free 225 225 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 5. JEDEC standard 51−6 multilayer board − 2S2P (2 signal, 2 power). 6. JEDEC standards multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad. |
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