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BYG26 Datasheet(PDF) 2 Page - NXP Semiconductors |
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BYG26 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2000 Feb 14 2 Philips Semiconductors Product specification SMA ultra fast soft-recovery controlled avalanche rectifiers BYG26 series FEATURES • Glass passivated • High maximum operating temperature • Ideal for surface mount automotive applications • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape • Marking: cathode, date code, type code • Easy pick and place. DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. olumns MSA474 Top view Side view cathode band ka Fig.1 Simplified outline (DO-214AC) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRRM repetitive peak reverse voltage BYG26D − 200 V BYG26G − 400 V BYG26J − 600 V VR continuous reverse voltage BYG26D − 200 V BYG26G − 400 V BYG26J − 600 V VRMS root mean square voltage BYG26D − 140 V BYG26G − 280 V BYG26J − 420 V IF(AV) average forward current averaged over any 20 ms period; Ttp =85 °C; see Fig.2 − 1A IFSM non-repetitive peak forward current t = 8.3 ms half sine wave; Tj =25 °C prior to surge; VR =VRRMmax − 15 A Tstg storage temperature −65 +175 °C Tj junction temperature See Fig.3 −65 +175 °C |
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