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NBC12429AMNG Datasheet(PDF) 5 Page - ON Semiconductor |
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NBC12429AMNG Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 21 page NBC12429, NBC12429A http://onsemi.com 5 Table 4. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kΩ Internal Input Pullup Resistor 37.5 kΩ ESD Protection Human Body Model Machine Model Charged Device Model >2kV > 150 V >1kV Moisture Sensitivity (Note 1) Pb Pkg Pb--Free Pkg PLCC LQFP QFN Level 1 Level 2 Level 1 Level 1 Level 2 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V--0 @ 0.125 in Transistor Count 2035 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 5. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC Positive Supply GND = 0 V 6 V VI Input Voltage GND = 0 V VI ± VCC 6 V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range NBC12429 NBC12429A 0to70 --40 to +85 °C Tstg Storage Temperature Range --65 to +150 °C θJA Thermal Resistance (Junction--to--Ambient) 0lfpm 500 lfpm PLCC--28 PLCC--28 63.5 43.5 °C/W °C/W θJC Thermal Resistance (Junction--to--Case) Standard Board PLCC--28 22 to 26 °C/W θJA Thermal Resistance (Junction--to--Ambient) 0lfpm 500 lfpm LQFP--32 LQFP--32 80 55 °C/W °C/W θJC Thermal Resistance (Junction--to--Case) Standard Board LQFP--32 12 to 17 °C/W θJA Thermal Resistance (Junction--to--Ambient) 0lfpm 500 lfpm QFN--32 QFN--32 31 27 °C/W °C/W θJC Thermal Resistance (Junction--to--Case) 2S2P QFN--32 12 °C/W Tsol Wave Solder Pb Pb--Free <3 sec @ 248°C <3 sec @ 260°C 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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