NTMS3P03R2

http://onsemi.com

2

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

−30

V

Gate−to−Source Voltage − Continuous

±20

V

Thermal Resistance −

Junction−to−Ambient (Note 1)

Continuous Drain Current @ 25°C

Continuous Drain Current @ 70°C

Pulsed Drain Current (Note 4)

171

0.73

−2.34

−1.87

−8.0

°C/W

W

A

A

A

Thermal Resistance −

Junction−to−Ambient (Note 2)

Continuous Drain Current @ 25°C

Continuous Drain Current @ 70°C

Pulsed Drain Current (Note 4)

100

1.25

−3.05

−2.44

−12

°C/W

W

A

A

A

Thermal Resistance −

Junction−to−Ambient (Note 3)

Continuous Drain Current @ 25°C

Continuous Drain Current @ 70°C

Pulsed Drain Current (Note 4)

62.5

2.0

−3.86

−3.1

−15

°C/W

W

A

A

A

Operating and Storage Temperature Range

−55 to +150

°C

140

mJ

Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Minimum FR−4 or G−10 PCB, t = steady state.

2. Mounted onto a 2″ square FR−4 Board (1″ sq. 2 oz Cu 0.06″ thick single sided), t = steady state.

3. Mounted onto a 2″ square FR−4 Board (1″ sq. 2 oz Cu 0.06″ thick single sided), t ≤ 10 seconds.

4. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.