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NTJD2152PT2 Datasheet(PDF) 2 Page - ON Semiconductor |
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NTJD2152PT2 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 6 page NTJD2152P http://onsemi.com 2 ELECTRICAL CHARACTERISTICS (TJ=25°C unless otherwise stated) Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = −250 mA −8.0 −10.5 V Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/ TJ −6.0 mV/°C Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = −6.4 V 1.0 mA Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = ±8.0 V 10 mA ON CHARACTERISTICS (Note 2) Gate Threshold Voltage VGS(TH) VGS = VDS, ID = −250 mA −0.45 −0.83 −1.0 V Gate Threshold Temperature Coefficient VGS(TH)/TJ 2.2 mV/ °C Drain−to−Source On Resistance RDS(on) VGS = −4.5 V, ID = −0.57 A 0.22 0.3 W VGS = −2.5 V, ID = −0.48 A 0.32 0.46 VGS = −1.8 V, ID = −0.20 A 0.51 0.9 Forward Transconductance gFS VGS = −4.0 V, ID = −0.57 A 2.0 S CHARGES AND CAPACITANCES Input Capacitance CISS VGS = 0 V, f = 1.0 MHz, VDS = −8.0 V 160 225 pF Output Capacitance COSS 38 55 Reverse Transfer Capacitance CRSS 28 40 Total Gate Charge QG(TOT) VGS = −4.5 V, VDS = −5.0 V, ID = −0.6 A 2.2 4.0 nC Threshold Gate Charge QG(TH) 0.1 Gate−to−Source Charge QGS 0.5 Gate−to−Drain Charge QGD 0.5 SWITCHING CHARACTERISTICS (Note 3) Turn−On Delay Time td(ON) VGS = −4.5 V, VDD = −4.0 V, ID = −0.5 A, RG = 8.0 W 13 ns Rise Time tr 23 Turn−Off Delay Time td(OFF) 50 Fall Time tf 36 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD VGS = 0 V, IS = −0.23 A TJ = 25°C 0.76 1.1 V TJ = 125°C 0.63 Reverse Recovery Time tRR VGS = 0 V, dIS/dt = 100 A/ms, IS = −0.77 A 78 ns 2. Pulse Test: pulse width ≤ 300ms, duty cycle ≤ 2%. 3. Switching characteristics are independent of operating junction temperatures. |
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