MC33375 Series

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14

PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AH

SEATING

PLANE

1

4

5

8

N

J

X 45

_

K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

A

B

S

D

H

C

0.10 (0.004)

DIM

A

MIN

MAX

MIN

MAX

INCHES

4.80

5.00

0.189

0.197

MILLIMETERS

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.053

0.069

D

0.33

0.51

0.013

0.020

G

1.27 BSC

0.050 BSC

H

0.10

0.25

0.004

0.010

J

0.19

0.25

0.007

0.010

K

0.40

1.27

0.016

0.050

M

0

8

0

8

N

0.25

0.50

0.010

0.020

S

5.80

6.20

0.228

0.244

−X−

−Y−

G

M

Y

M

0.25 (0.010)

−Z−

Y

M

0.25 (0.010)

Z

S

M

__

__

1.52

0.060

7.0

0.275

0.6

0.024

1.270

0.050

4.0

0.155

mm

inches

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MC33375/D

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