MC33275, NCV33275

http://onsemi.com

12

PACKAGE DIMENSIONS

SOT−223 (TO−261)

ST SUFFIX

CASE 318E−04

ISSUE K

H

S

F

A

B

D

G

L

4

12

3

0.08 (0003)

C

M

K

J

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.249

0.263

6.30

6.70

INCHES

B

0.130

0.145

3.30

3.70

C

0.060

0.068

1.50

1.75

D

0.024

0.035

0.60

0.89

F

0.115

0.126

2.90

3.20

G

0.087

0.094

2.20

2.40

H 0.0008 0.0040

0.020

0.100

J

0.009

0.014

0.24

0.35

K

0.060

0.078

1.50

2.00

L

0.033

0.041

0.85

1.05

M

0

10

0

10

S

0.264

0.287

6.70

7.30

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

__

_

_

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.5

0.059

mm

inches

SCALE 6:1

3.8

0.15

2.0

0.079

6.3

0.248

2.3

0.091

2.3

0.091

2.0

0.079