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MMBZ5221ELT1_0508 Datasheet(PDF) 1 Page - ON Semiconductor

Part No. MMBZ5221ELT1_0508
Description  Zener Voltage Regulators 225 mW SOT−23 Surface Mount
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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MMBZ5221ELT1_0508 Datasheet(HTML) 1 Page - ON Semiconductor

   
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© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 6
1
Publication Order Number:
MMBZ5221ELT1/D
MMBZ5221ELT1 Series
Preferred Device
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
225 mW Rating on FR−4 or FR−5 Board
Zener Voltage Range − 2.4 V to 91 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
Peak Power − 225 W (8 x 20 ms)
Pb−Free Packages are Available
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260
°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Peak Power Dissipation @ 20
ms (Note 1)
@ TL ≤ 25°C
Ppk
225
W
Total Power Dissipation on FR−5 Board,
(Note 2) @ TA = 25°C
Derated above 25
°C
PD
225
1.8
mW
mW/
°C
Thermal Resistance, Junction−to−Ambient
RqJA
556
°C/W
Total Power Dissipation on Alumina
Substrate, (Note 3) @ TA = 25°C
Derated above 25
°C
PD
300
2.4
mW
mW/
°C
Thermal Resistance, Junction−to−Ambient
RqJA
417
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−65 to
+150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
3
Cathode
1
Anode
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
DEVICE MARKING INFORMATION
http://onsemi.com
SOT−23
CASE 318
STYLE 8
MARKING
DIAGRAM
1
3
2
1
Bxx M
G
G
Bxx
= Device Code
xx
= (Refer to page 2)
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Device
Package
Shipping
ORDERING INFORMATION
MMBZ52xxELT1
SOT−23
3000/Tape & Reel
MMBZ52xxELT3G
SOT−23
(Pb−Free)
10000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MMBZ52xxELT1G
SOT−23
(Pb−Free)
3000/Tape & Reel
MMBZ52xxELT3
SOT−23
10000/Tape & Reel
Devices listed in bold, italic are ON Semiconductor
Preferred devices. Preferred devices are recommended
choices for future use and best overall value.


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