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250R Datasheet(PDF) 4 Page - Littelfuse

Part No. 250R
Description  POLYFUSE Resettable PTCs Radial Leaded
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Maker  LITTELFUSE [Littelfuse]
Homepage  http://www.littelfuse.com
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250R Datasheet(HTML) 4 Page - Littelfuse

   
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©2006 Littelfuse
250R Series
Specifications are subject to change without notice.

Electronics Designers Guide
POLYFUSE® Resettable PTCs
Radial Leaded
Environmental Specifications
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging
65°C/85°C, 1000 hours
Humidity Aging
+85°C, 85%R.H. 1000 hours
Thermal Shock
MIL-STD-202F Method 107G
+125°C to -55°C 10 times
Solvent Resistance
MIL-STD-202, Method 215F
Physical Specifications
Lead Material
Tin-plated copper
Soldering
Characteristics
Solderability per MIL-STD-202,
Method 208E
Insulating Material
Cured, flame retardant epoxy polymer
meets UL94V-0 requirements.
Device Labeling
Marked with LF, voltage, current rating,
and date code.
Soldering Parameters - Solder Reflow
Condition
Reflow
Peak Temp/ Duration Time
260°C > 5 Sec
> 220°C
30 Sec ~ 60 Sec
Preheat 160°C ~ 190°C
60 Sec ~ 90 Sec
Storage Condition
0°C~35°C, < 70%RH
• Recommended reflow methods: IR, vapor phase oven, hot
air oven, N
2 environment for lead-free.
• Devices are not designed to be wave soldered to the
bottom side of the board.
• Devices can be cleaned using standard industry methods
and solvents.
Note: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Preheating
160
190
220
260
0
30 to 60
Soldering
Cooling
120
60 to 90
Time(s)
Soldering Parameters - Wave Soldering
Condition
Wave Soldering
Peak Temp/ Duration Time
260°C < 5 Sec
> 220°C
2 Sec ~ 20 Sec
Preheat 140°C ~ 180°C
180 Sec ~ 210 Sec
Storage Condition
0°C~35°C < 70%RH
• Recommended soldering methods: heat element oven or
N
2 environment for lead-free.
• Devices are designed to be wave soldered to the bottom
side of the board.
• Devices can be cleaned using standard industry methods
and solvents.
• This profile can be used for lead-free device
Note: If soldering temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Preheating
160
190
220
260
0
2 to 5
Soldering
Cooling
20-30
180 to 210
Time(s)


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