 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
MM3Z2V4T1 Datasheet(PDF) 1 Page - ON Semiconductor |
|
||||||||||||||||||||||||||||||
MM3Z2V4T1 Datasheet(HTML) 1 Page - ON Semiconductor |
|
|
1 / 5 page 
© Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 7 1 Publication Order Number: MM3Z2V4T1/D MM3Z2V4T1 SERIES Zener Voltage Regulators 200 mW SOD−323 Surface Mount This series of Zener diodes is packaged in a SOD−323 surface mount package that has a power dissipation of 200 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Specification Features: • Standard Zener Breakdown Voltage Range − 2.4 V to 75 V • Steady State Power Rating of 200 mW • Small Body Outline Dimensions: 0.067” x 0.049” (1.7 mm x 1.25 mm) • Low Body Height: 0.035” (0.9 mm) • Package Weight: 4.507 mg/Unit • ESD Rating of Class 3 (>16 kV) per Human Body Model • Pb−Free Packages are Available Mechanical Characteristics: CASE: Void-free, Transfer-Molded Plastic FINISH: All External Surfaces are Corrosion Resistant MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 °C for 10 Seconds LEADS: Plated with Pb−Sn or Sn Only (Pb−Free) POLARITY: Cathode Indicated by Polarity Band FLAMMABILITY RATING: UL 94 V−0 MOUNTING POSITION: Any MAXIMUM RATINGS Rating Symbol Max Unit Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25 °C PD 200 1.5 mW mW/ °C Thermal Resistance, Junction−to−Ambient RqJA 635 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 Minimum Pad 1 Cathode 2 Anode See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. DEVICE MARKING INFORMATION Device Package Shipping† ORDERING INFORMATION MM3ZxxxT1 SOD−323 3000/Tape & Reel MARKING DIAGRAM †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MM3ZxxxT1G SOD−323 (Pb−Free) 3000/Tape & Reel http://onsemi.com SOD−323 CASE 477 STYLE 1 (Note: Microdot may be in either location) 1 2 xx G G *Date Code orientation may vary depending upon manufacturing location. xx = Specific Device Code M = Date Code* G = Pb−Free Package |
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
