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MM3Z2V4ST1 Datasheet(PDF) 1 Page - ON Semiconductor

Part No. MM3Z2V4ST1
Description  Zener Voltage Regulators 200 mW SOD−323 Surface Mount Tight Tolerance Portfolio
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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MM3Z2V4ST1 Datasheet(HTML) 1 Page - ON Semiconductor

   
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© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 13
1
Publication Order Number:
MM3Z2V4ST1/D
MM3Z2V4ST1 SERIES
Zener Voltage Regulators
200 mW SOD−323 Surface Mount
Tight Tolerance Portfolio
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 200 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand−held portables,
and high density PC boards.
Specification Features:
Standard Zener Breakdown Voltage Range −
2.4 V to 18 V
Steady State Power Rating of 200 mW
Small Body Outline Dimensions:
0.067
″ x 0.049″ (1.7 mm x 1.25 mm)
Low Body Height: 0.035″ (0.9 mm)
Package Weight: 4.507 mg/unit
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance VZ
Pb−Free Packages are Available
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260
°C for 10 Seconds
LEADS:
Plated with Pb−Sn or Sn only (Pb−Free)
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MOUNTING POSITION:
Any
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25
°C
PD
200
1.5
mW
mW/
°C
Thermal Resistance from
Junction−to−Ambient
RqJA
635
°C/W
Junction and Storage
Temperature Range
TJ, Tstg
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
Device
Package
Shipping
ORDERING INFORMATION
SOD−323
CASE 477
STYLE 1
1
Cathode
2
Anode
MM3ZxxxST1
SOD−323
3000/Tape & Reel
MARKING
DIAGRAM
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
DEVICE MARKING INFORMATION
XX = Specific Device Code
M = Date Code*
G = Pb−Free Package
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
http://onsemi.com
MM3ZxxxST3
SOD−323
10,000/Tape & Reel
MM3ZxxxST1G
SOD−323
(Pb−Free)
3000/Tape & Reel
MM3ZxxxST3G
SOD−323
(Pb−Free)
10,000/Tape & Reel
1
2
XXM
G
G
*Date Code orientation may vary
depending upon manufacturing location.
(Note: Microdot may be in either location)


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