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BZX84C2V4ET1G Datasheet(PDF) 1 Page - ON Semiconductor |
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BZX84C2V4ET1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page © Semiconductor Components Industries, LLC, 2005 August, 2005 − Rev. 5 1 Publication Order Number: BZX84C2V4ET1/D BZX84C2V4ET1 Series Zener Voltage Regulators 225 mW SOT−23 Surface Mount This series of Zener diodes is offered in the convenient, surface mount plastic SOT−23 package. These devices are designed to provide voltage regulation with minimum space requirement. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Specification Features • 225 mW Rating on FR−4 or FR−5 Board • Zener Breakdown Voltage Range − 2.4 V to 75 V • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • ESD Rating of Class 3 (>16 kV) per Human Body Model • Peak Power − 225 W (8 X 20 ms) • Pb−Free Packages are Available Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 °C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MAXIMUM RATINGS Rating Symbol Max Unit Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°C Ppk 225 W Total Power Dissipation on FR−5 Board, (Note 2) @ TA = 25°C Derated above 25 °C PD 225 1.8 mW mW/ °C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Total Power Dissipation on Alumina Sub- strate, (Note 3) @ TA = 25°C Derated above 25 °C PD 300 2.4 mW mW/ °C Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Nonrepetitive current pulse per Figure 9. 2. FR−5 = 1.0 X 0.75 X 0.62 in. 3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina. Device Package Shipping† ORDERING INFORMATION SOT−23 CASE 318 STYLE 8 3 Cathode 1 Anode BZX84CxxxET1 SOT−23 3000/Tape & Reel MARKING DIAGRAM BZX84CxxxET3 SOT−23 10,000/Tape & Reel 3 1 2 http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. DEVICE MARKING INFORMATION BZX84CxxxET1G SOT−23 (Pb−Free) 3000/Tape & Reel 1 xxx M G G BZX84CxxxET3G SOT−23 (Pb−Free) 10,000/Tape & Reel xxx = Device Code M = Date Code* G = Pb−Free Package *Date Code orientation may vary depending upon manufacturing location. (Note: Microdot may be in either location) |
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