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BUB323Z Datasheet(PDF) 7 Page - ON Semiconductor |
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BUB323Z Datasheet(HTML) 7 Page - ON Semiconductor |
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7 / 8 page 
BUB323Z http://onsemi.com 7 PACKAGE DIMENSIONS D2PAK CASE 418B−04 ISSUE J STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 8.38 0.33 1.016 0.04 17.02 0.67 10.66 0.42 3.05 0.12 5.08 0.20 mm inches SCALE 3:1 SEATING PLANE S G D −T− M 0.13 (0.005) T 23 1 4 3 PL K J H V E C A DIM MIN MAX MIN MAX MILLIMETERS INCHES A 0.340 0.380 8.64 9.65 B 0.380 0.405 9.65 10.29 C 0.160 0.190 4.06 4.83 D 0.020 0.035 0.51 0.89 E 0.045 0.055 1.14 1.40 G 0.100 BSC 2.54 BSC H 0.080 0.110 2.03 2.79 J 0.018 0.025 0.46 0.64 K 0.090 0.110 2.29 2.79 S 0.575 0.625 14.60 15.88 V 0.045 0.055 1.14 1.40 −B− M B W W NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. F 0.310 0.350 7.87 8.89 L 0.052 0.072 1.32 1.83 M 0.280 0.320 7.11 8.13 N 0.197 REF 5.00 REF P 0.079 REF 2.00 REF R 0.039 REF 0.99 REF M L F M L F M L F VARIABLE CONFIGURATION ZONE R N P U VIEW W−W VIEW W−W VIEW W−W 12 3 |
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