CS8120

http://onsemi.com

9

Figure 15. Single Output Regulator With Key

Performance Parameters Labeled

SMART

Control

Features

HEAT SINKS

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

R

QJA + RQJC ) RQCS ) RQSA

(3)

where:

functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.