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PLL1705DBQG4 Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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PLL1705DBQG4 Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 18 page PLL1705 PLL1706 SLES046A – AUGUST 2002 – REVISED SEPTEMBER 2002 www.ti.com 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE CODE OPERATION TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA PLL1705DBQ SSOP 20 20DBQ 25 °Cto85°C PLL1705 PLL1705DBQ Tube PLL1705DBQ SSOP 20 20DBQ –25 °C to 85°C PLL1705 PLL1705DBQR Tape and reel PLL1706DBQ SSOP 20 20DBQ 25 °Cto85°C PLL1706 PLL1706DBQ Tube PLL1706DBQ SSOP 20 20DBQ –25 °C to 85°C PLL1706 PLL1706DBQR Tape and reel ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) PLL1705 AND PLL1706 Supply voltage: VCC, VDD1–3 4 V Supply voltage differences: VCC, VDD1–3 ±0.1 V Ground voltage differences: AGND, DGND1–3 ±0.1 V Digital input voltage: FS1 (MD), FS2 (MC), SR (ML), CSEL – 0.3 V to (VDD + 0.3) V Analog input voltage, XT1, XT2 – 0.3 V to (VCC + 0.3) V Input current (any pins except supplies) ±10 mA Ambient temperature under bias –40 °C to 125°C Storagetemperature –55 °C to 150°C Junctiontemperature 150 °C Lead temperature (soldering) 260 °C, 5 s Package temperature (IR reflow, peak) 260 °C (1) Stressesbeyondthoselistedunder“absolutemaximumratings”maycausepermanentdamagetothedevice.Thesearestressratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. |
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