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ABSOLUTE MAXIMUM RATINGS

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TopView

SSOP

300W

300W

300W

300W

300W

300W

1

2

3

4

5

6

7

8

-INA

-INB

-INC

+INA

DISB

DISC

+INB

+INC

9

10

11

12

13

14

15

16

+V

S

+V

S

DISA

OUTC

OUTB

OUTA

OPA3693

CHA

CHB

CHC

OPA3693

SBOS353 – DECEMBER 2006

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

PACKAGE

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

OPA3693IDBQ

Rail, 75

OPA3693

SSOP-16

DBQ

–40

°C to +85°C

OP3693

OPA3693IDBQR

Tape and Reel, 2500

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For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Power Supply

±6.5V

DC

Internal Power Dissipation

See Thermal Analysis

Differential Input Voltage

±1.2V

Input Common-Mode Voltage Range

±V

S

Storage Temperature Range

–40

°C to +125°C

Lead Temperature (soldering, 10s)

+300

°C

Peak

+150

°C

Maximum Junction

Continuous Operation, Long-Term Reliability

+140

°C

Human Body Model (HBM)

1500V

ESD Rating

Charge Device Model (CDM)

1000V

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Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these and any other conditions beyond

those specified is not supported.

2

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