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BUK474-200A Datasheet(PDF) 1 Page - NXP Semiconductors

Part # BUK474-200A
Description  PowerMOS transistor Isolated version of BUK454-200A/B
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUK474-200A Datasheet(HTML) 1 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
PowerMOS transistor
BUK474-200A/B
Isolated version of BUK454-200A/B
GENERAL DESCRIPTION
QUICK REFERENCE DATA
N-channel
enhancement
mode
SYMBOL
PARAMETER
MAX.
MAX.
UNIT
field-effect power transistor in a
plastic
full-pack
envelope.
The
BUK474
-200A
-200B
device is intended for use in Switched
V
DS
Drain-source voltage
200
200
V
Mode
Power
Supplies
(SMPS),
I
D
Drain current (DC)
5.3
4.7
A
motor control, welding, DC/DC and
P
tot
Total power dissipation
25
25
W
AC/DC converters, and in general
R
DS(ON)
Drain-source on-state
0.4
0.5
purpose switching applications.
resistance
PINNING - SOT186A
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
gate
2
drain
3
source
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DS
Drain-source voltage
-
-
200
V
V
DGR
Drain-gate voltage
R
GS = 20 kΩ
-
200
V
±V
GS
Gate-source voltage
-
-
30
V
-200A
-200B
I
D
Drain current (DC)
T
hs =
25 ˚C
-
5.3
4.7
A
I
D
Drain current (DC)
T
hs = 100 ˚C
-
3.3
3.0
A
I
DM
Drain current (pulse peak value)
T
hs =
25 ˚C
-
21
19
A
P
tot
Total power dissipation
T
hs =
25 ˚C
-
25
W
T
stg
Storage temperature
-
- 55
150
˚C
T
j
Junction temperature
-
-
150
˚C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
R
th j-hs
Thermal resistance junction to
with heatsink compound
-
-
5
K/W
heatsink
R
th j-a
Thermal resistance junction to
-
55
-
K/W
ambient
12 3
case
d
g
s
April 1998
1
Rev 1.100


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