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TPA6211A1DGN Datasheet(PDF) 2 Page - Texas Instruments |
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TPA6211A1DGN Datasheet(HTML) 2 Page - Texas Instruments |
2 / 29 page www.ti.com ABSOLUTE MAXIMUM RATINGS PACKAGE DISSIPATION RATINGS TPA6211A1 SLOS367B – AUGUST 2003 – REVISED AUGUST 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PACKAGED DEVICES(1) TA EVALUATION MODULES SMALL OUTLINE MSOP PowerPAD™ (DRB) (DGN) -40 °C to 85°C TPA6211A1DRB TPA6211A1DGN TPA6211A1EVM (1) The DGN and DRB are available taped and reeled. To order taped and reeled parts, add the suffix R to the part number (TPA6211A1DGNR or TPA6211A1DRBR). Terminal Functions TERMINAL I/O DESCRIPTION NAME DRB, DGN IN- 4 I Negative differential input IN+ 3 I Positive differential input VDD 6 I Power supply VO+ 5 O Positive BTL output GND 7 I High-current ground VO- 8 O Negative BTL output SHUTDOWN 1 I Shutdown terminal (active low logic) BYPASS 2 Mid-supply voltage, adding a bypass capacitor improves PSRR Connect to ground. Thermal pad must be soldered down in all applications to properly secure Thermal Pad - - device on the PCB. over operating free-air temperature range unless otherwise noted(1) UNIT VDD Supply voltage -0.3 V to 6 V VI Input voltage -0.3 V to VDD + 0.3 V Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature -40 °C to 85°C TJ Junction temperature -40 °C to 150°C Tstg Storage temperature -65 °C to 85°C DRB 260 °C Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds DGN 235 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. TA ≤ 25°C DERATING TA= 70°C TA= 85°C PACKAGE POWER RATING FACTOR(1) POWER RATING POWER RATING DGN 2.13 W 17.1 mW/ °C 1.36 W 1.11 W DRB 2.7 W 21.8 mW/ °C 1.7 W 1.4 W (1) Derating factor based on high-k board layout. 2 |
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