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TPA6211A1 Datasheet(PDF) 2 Page - Texas Instruments

Part No. TPA6211A1
Description  3.1-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPA6211A1 Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
PACKAGE DISSIPATION RATINGS
TPA6211A1
SLOS367B – AUGUST 2003 – REVISED AUGUST 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGED DEVICES(1)
TA
EVALUATION MODULES
SMALL OUTLINE
MSOP PowerPAD™
(DRB)
(DGN)
-40
°C to 85°C
TPA6211A1DRB
TPA6211A1DGN
TPA6211A1EVM
(1)
The DGN and DRB are available taped and reeled. To order taped and reeled parts, add the suffix R
to the part number (TPA6211A1DGNR or TPA6211A1DRBR).
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
DRB, DGN
IN-
4
I
Negative differential input
IN+
3
I
Positive differential input
VDD
6
I
Power supply
VO+
5
O
Positive BTL output
GND
7
I
High-current ground
VO-
8
O
Negative BTL output
SHUTDOWN
1
I
Shutdown terminal (active low logic)
BYPASS
2
Mid-supply voltage, adding a bypass capacitor improves PSRR
Connect to ground. Thermal pad must be soldered down in all applications to properly secure
Thermal Pad
-
-
device on the PCB.
over operating free-air temperature range unless otherwise noted(1)
UNIT
VDD
Supply voltage
-0.3 V to 6 V
VI
Input voltage
-0.3 V to VDD + 0.3 V
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature
-40
°C to 85°C
TJ
Junction temperature
-40
°C to 150°C
Tstg
Storage temperature
-65
°C to 85°C
DRB
260
°C
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds
DGN
235
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
TA ≤ 25°C
DERATING
TA= 70°C
TA= 85°C
PACKAGE
POWER RATING
FACTOR(1)
POWER RATING
POWER RATING
DGN
2.13 W
17.1 mW/
°C
1.36 W
1.11 W
DRB
2.7 W
21.8 mW/
°C
1.7 W
1.4 W
(1)
Derating factor based on high-k board layout.
2


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