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TPA321DGNRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TPA321DGNRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATING TABLE RECOMMENDED OPERATING CONDITIONS TPA321 SLOS312C – JUNE 2000 – REVISED JUNE 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS PACKAGED DEVICES MSOP TA SYMBOLIZATION SMALL OUTLINE(1) (D) MSOP(1) (DGN) –40 °C to 85°C TPA321D TPA321DGN AJB (1) The D and DGN packages are available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA321DR). over operating free-air temperature range (unless otherwise noted)(1) UNIT VDD Supply voltage 6 V VI Input voltage –0.3 V to VDD +0.3 V Continuous total power dissipation Internally limited (see Dissipation Rating Table) TA Operating free-air temperature range –40 °C to 85°C TJ Operating junction temperature range –40 °C to 150°C Tstg Storage temperature range –65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C D 725 mW 5.8 mW/ °C 464 mW 377 mW DGN 2.14 W(1) 17.1 mW/ °C 1.37 W 1.11 W (1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (literature number SLMA002), for more information on the PowerPAD™ package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document. MIN MAX UNIT VDD Supply voltage 2.5 5.5 V VIH High-level voltage SHUTDOWN 0.9 VDD V VIL Low-level voltage SHUTDOWN 0.1 VDD V TA Operating free-air temperature –40 85 °C 2 |
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