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TPA311 Datasheet(PDF) 1 Page - Texas Instruments

Part No. TPA311
Description  350-mW MONO AUDIO POWER AMPLIFIER
Download  35 Pages
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TPA311 Datasheet(HTML) 1 Page - Texas Instruments

 
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TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207C – JANUARY 1998 – REVISED MAY 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Fully Specified for 3.3-V and 5-V Operation
D Wide Power Supply Compatibility
2.5 V – 5.5 V
D Output Power for RL = 8 Ω
– 350 mW at VDD = 5 V, BTL
– 250 mW at VDD = 5 V, SE
– 250 mW at VDD = 3.3 V, BTL
– 75 mW at VDD = 3.3 V, SE
D Shutdown Control
– IDD = 7 µA at 3.3 V
– IDD = 60 µA at 5 V
D BTL to SE Mode Control
D Integrated Depop Circuitry
D Thermal and Short-Circuit Protection
D Surface Mount Packaging
– SOIC
– PowerPAD
 MSOP
description
The TPA311 is a bridge-tied load (BTL) or
single-ended (SE) audio power amplifier devel-
oped especially for low-voltage applications
where internal speakers and external earphone
operation are required. Operating with a 3.3-V
supply, the TPA311 can deliver 250-mW of
continuous power into a BTL 8-
Ω load at less than 1% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as
cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. A unique
feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive
is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load.
This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually
eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an
8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by
50% and height by 40%.
Audio
Input
Bias
Control
350 mW
6
5
7
VO+
VDD
3
1
2
4
BYPASS
IN
SE/BTL
VDD/2
CI
RI
CS
CBF
RF
SHUTDOWN
From HP Jack
VO–8
GND
From System Control
CC
+
+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
 1998 – 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
SHUTDOWN
BYPASS
SE/BTL
IN
VO
GND
VDD
VO+
D OR DGN PACKAGE
(TOP VIEW)
PowerPAD is a trademark of Texas Instruments.


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