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TAS5112ADCAG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TAS5112ADCAG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 22 page TAS5112A SLES094A - OCTOBER 2003 - REVISED MARCH 2004 www.ti.com 2 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. GENERAL INFORMATION Terminal Assignment The TAS5112A is offered in a thermally enhanced 56-pin TSSOP DFD (thermal pad is on the top), shown as follows. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GND GND GREG OTW SD_CD SD_AB PWM_DP PWM_DM RESET_CD PWM_CM PWM_CP DREG_RTN M3 M2 M1 DREG PWM_BP PWM_BM RESET_AB PWM_AM PWM_AP GND DGND GND DVDD GREG GND GND GND GVDD BST_D PVDD_D PVDD_D OUT_D OUT_D GND GND OUT_C OUT_C PVDD_C PVDD_C BST_C BST_B PVDD_B PVDD_B OUT_B OUT_B GND GND OUT_A OUT_A PVDD_A PVDD_A BST_A GVDD GND DFD PACKAGE (TOP VIEW) Absolute Maximum Ratings over operating free-air temperature range unless otherwise noted(1) TAS5112A UNITS DVDD TO DGND –0.3 V to 4.2 V GVDD TO GND 33.5 V PVDD_X TO GND (dc voltage) 33.5 V PVDD_X TO GND (spike voltage(2)) 48 V OUT_X TO GND (dc voltage) 33.5 V OUT_X TO GND (spike voltage(2)) 48 V BST_X TO GND (dc voltage) 48 V BST_X TO GND (spike voltage(2)) 53 V GREG TO GND (3) 14.2 V PWM_XP, RESET, M1, M2, M3, SD, OTW –0.3 V to DVDD + 0.3 V Maximum operating junction temperature, TJ –40 °C to 150°C Storage temperature –40 °C to 125°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute- maximum-rated conditions for extended periods may affect device reliability. (2) The duration of voltage spike should be less than 100 ns; see application note SLEA025. (3) GREG is treated as an input when the GREG pin is overdriven by GVDD of 12 V. Package Dissipation Ratings PACKAGE RθJC ( °C/W) RθJA ( °C/W) 56-pin DFD TSSOP 1.14 See Note 4 (4) The TAS5112A package is thermally enhanced for conductive cooling using an exposed metal pad area. It is impractical to use the device with the pad exposed to ambient air as the only heat sinking of the device. For this reason, RθJA, a system parameter that characterizes the thermal treatment, is provided in the Application Information section of the data sheet. An example and discussion of typical system RθJA values are provided in the Thermal Information section. This example provides additional information regarding the power dissipation ratings. This example should be used as a reference to calculate the heat dissipation ratings for a specific application. TI application engineering provides technical support to design heatsinks if needed. Ordering Information TA PACKAGE DESCRIPTION 0 °C to 70°C TAS5112ADFD 56-pin small TSSOP For the most current specification and package information, refer to our Web site at www.ti.com. |
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