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1N5822 Datasheet(PDF) 6 Page - ON Semiconductor

Part # 1N5822
Description  Axial Lead Rectifiers
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

1N5822 Datasheet(HTML) 6 Page - ON Semiconductor

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1N5820, 1N5821, 1N5822
http://onsemi.com
6
3.0
0.1
IF(AV), AVERAGE FORWARD CURRENT (AMP)
10
7.0
5.0
0.7
0.5
0.1
5.0
0.2
0.3
0.5
2.0
3.0
2.0
1.0
0.3
0.2
0.7 1.0
7.0 10
Figure 6. Forward Power Dissipation 1N5820−22
dc
SQUARE WAVE
TJ ≈ 125°C
SINE WAVE
I
(FM)
I
(AV)
+ p (Resistive Load)
Capacitive
Loads
5.0
10
20
TA(A)
TA(K)
TL(A)
TC(A)
TJ
TC(K)
TL(K)
PD
RqS(A)
RqL(A)
RqJ(A)
RqJ(K
)
RqL(K)
RqS(K)
NOTE 4 − APPROXIMATE THERMAL CIRCUIT MODEL
Use of the above model permits junction to lead thermal
resistance for any mounting configuration to be found. For
a given total lead length, lowest values occur when one side
of the rectifier is brought as close as possible to the heat sink.
Terms in the model signify:
TA = Ambient Temperature
TC = Case Temperature
TL = Lead Temperature
TJ = Junction Temperature
RqS = Thermal Resistance, Heatsink to Ambient
RqL = Thermal Resistance, Lead−to−Heatsink
RqJ = Thermal Resistance, Junction−to−Case
PD = Total Power Dissipation = PF + PR
PF = Forward Power Dissipation
PR = Reverse Power Dissipation
(Subscripts (A) and (K) refer to anode and cathode sides,
respectively.) Values for thermal resistance components
are:
RqL = 42°C/W/in typically and 48°C/W/in maximum
RqJ = 10°C/W typically and 16°C/W maximum
The maximum lead temperature may be found as follows:
TL = TJ(max) * n TJL
where
n TJL [ RqJL · PD
TYPICAL VALUES FOR RqJA IN STILL AIR
Data shown for thermal resistance junction−to−ambient (RqJA)
for the mountings shown is to be used as typical guideline values
for preliminary engineering, or in case the tie point temperature
cannot be measured.
1
2
3
Mounting
Method
Lead Length, L (in)
1/8
1/4
1/2
3/4
RqJA
50
51
53
55
°C/W
°C/W
°C/W
58
59
61
63
28
NOTE 5 — MOUNTING DATA
Mounting Method 1
P.C. Board where available
copper surface is small.
Mounting Method 3
P.C. Board with
2−1/2, x 2−1/2,
copper surface.
BOARD GROUND
PLANE
VECTOR PUSH−IN
TERMINALS T−28
Mounting Method 2
LL
LL
L = 1/2


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