Electronic Components Datasheet Search |
|
AD5821D-WAFER Datasheet(PDF) 15 Page - Analog Devices |
|
AD5821D-WAFER Datasheet(HTML) 15 Page - Analog Devices |
15 / 16 page AD5821 Rev. 0 | Page 15 of 16 OUTLINE DIMENSIONS SEATING PLANE 0.50 BSC BALL PITCH 1.575 1.515 1.455 1.750 1.690 1.630 0.28 0.24 0.20 0.36 0.32 0.28 0.65 0.59 0.53 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) A 1 2 3 B C BALL 1 IDENTIFIER Figure 27. 9-Ball Wafer Level Chip Scale Package [WLCSP] (CB-9-1) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option Branding AD5821BCBZ-REEL71 −40°C to +85°C 9-Ball Wafer Level Chip Scale Package (WLCSP) CB-9-1 D82 AD5821BCBZ-REEL1 −40°C to +85°C 9-Ball Wafer Level Chip Scale Package (WLCSP) CB-9-1 D82 AD5821-WAFER −40°C to +85°C Bare Die Wafer AD5821D-WAFER −40°C to +85°C Bare Die Wafer on Film EVAL-AD5821EBZ1 Evaluation Board 1 Z = Pb-free part. |
Similar Part No. - AD5821D-WAFER |
|
Similar Description - AD5821D-WAFER |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |