Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

TSC2101 Datasheet(PDF) 3 Page - Texas Instruments

Part No. TSC2101
Description  AUDIO CODEC WITH INTEGRATED HEADPHONE, SPEAKER AMPLIFIER AND TOUCH SCREEN CONTROLLER
Download  93 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TSC2101 Datasheet(HTML) 3 Page - Texas Instruments

  TSC2101_07 Datasheet HTML 1Page - Texas Instruments TSC2101_07 Datasheet HTML 2Page - Texas Instruments TSC2101_07 Datasheet HTML 3Page - Texas Instruments TSC2101_07 Datasheet HTML 4Page - Texas Instruments TSC2101_07 Datasheet HTML 5Page - Texas Instruments TSC2101_07 Datasheet HTML 6Page - Texas Instruments TSC2101_07 Datasheet HTML 7Page - Texas Instruments TSC2101_07 Datasheet HTML 8Page - Texas Instruments TSC2101_07 Datasheet HTML 9Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 3 / 93 page
background image
TSC2101
SLAS392D− JUNE 2003 − REVISED MAY 2005
www.ti.com
3
Terminal Functions
PIN
NAME
DESCRIPTION
PIN
NAME
DESCRIPTION
1
IOVDD
IO Supply
25
MIC_DETECT_IN Microphone detect input
2
PWR_DN
Hardware power down
26
OUT32N
Receiver driver output
3
RESET
Hardware reset
27
SPK1
Headset driver output/receiver driver output
4
GPIO2
General purpose IO
28
SPK2
Headset driver output
5
GPIO1
General purpose IO
29
DRVDD
Headphone driver power supply
6
AVDD2
Touch screen drivers, PLL analog
power supply
30
SPKFC
Driver feedback/ speaker detect input
7
AVSS2
Analog ground
31
VGND
Virtual ground for audio output
8
AVDD1
Audio ADC, DAC, reference, SAR
ADC analog power supply
32
DRVSS1
Driver ground
9
X+
X+ Position input and driver
33
OUT8N
Loudspeaker driver output
10
Y+
Y+ Position input and driver
34
BVDD
Battery power supply
11
X−
X− Position input and driver
35
OUT8P
Loudspeaker driver output
12
Y−
Y− Position input and driver
36
DRVSS2
Driver ground
13
AVSS1
Analog ground
37
PINTDAV
Pin interrupt/data available output
14
VREF
Reference voltage
38
SS
SPI Slave select input
15
VBAT
Battery monitor input
39
MOSI
SPI Serial data input
16
AUX2
Secondary auxiliary input
40
MISO
SPI Serial data output
17
AUX1
First auxiliary input
41
SCLK
SPI Serial clock input
18
BUZZ_IN
Buzzer input
42
MCLK
Master clock
19
CP_OUT
Output to cell phone module
43
SDOUT
Audio data output
20
CP_IN
Input from cell phone module
44
SDIN
Audio data input
21
MICIN_HND
Handset microphone input
45
WCLK
Audio word clock
22
MICBIAS_HND
Handset microphone bias voltage
46
BCLK
Audio bit clock
23
MICIN_HED
Headset microphone input
47
DVDD
Digital core supply
24
MICBIAS_HED
Headset microphone bias voltage
48
DVSS
Digital core and IO ground
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1), (2)
UNITS
AVDD1/2 to AVSS1/2
−0.3 V to 3.9 V
DRVDD to DRVSS1/2
−0.3 V to 3.9 V
BVDD to DRVSS1/2
−0.3 V to 4.5 V
IOVDD to DVSS
−0.3 V to 3.9 V
Digital input voltage to DVSS
−0.3 V to IOVDD + 0.3 V
Analog input (except VBAT) voltage to AVSS1/2
−0.3 V to AVDD + 0.3 V
VBAT input voltage to AVSS1/2
−0.3 V to 6 V
AVSS1/2 to DRVSS1/2 to DVSS
−0.1 V to 0.1 V
AVDD1/2 to DRVDD
−0.1 V to 0.1 V
Operating temperature range
−40°C to 85°C
Storage temperature range
−65°C to 105°C
Junction temperature (TJ Max)
105°C
QFN package
Power dissipation
(TJ Max − TA)/θJA
QFN package
θJA Thermal impedance (with thermal pad soldered to board)
27°C/W
Lead temperature
Infrared (15 sec)
240°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If the TSC2101 is used to drive high power levels to an 8-Ω load for extended intervals at an ambient temperature above 80°C, multiple vias should
be used to electrically and thermally connect the thermal pad on the QFN package to an internal heat dissipating ground plane on the user’s PCB.


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30  31  32  33  34  35  36  37  38  39  40  41  42  43  44  45  46  47  48  49  50  51  52  53  54  55  56  57  58  59  60  61  62  63  64  65  66  67  68  69  70  71  72  73  74  75  76  77  78  79  80  81  82  83  84  85  86  87  88  89  90  91  92  93 


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn