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TS922 Datasheet(PDF) 14 Page - STMicroelectronics

Part No. TS922
Description  Rail-to-rail high output current dual operational amplifier
Download  21 Pages
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
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TS922 Datasheet(HTML) 14 Page - STMicroelectronics

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Package mechanical data
TS922
14/21
5
Package mechanical data
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a Lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
5.1
Flip-chip package (8 bumps)
Figure 14.
Top view and dimensions of 8-bump flip-chip
Figure 15.
Flip-chip footprint recommendation
Die size: 1600µm x 1600µm ±30µm
Die height: 350µm ±20µm
Die height (including bumps):
600µm
Bumps diameter: 315µm ±50µm
Bumps height: 250µm ±40µm
Pitch: 500µm ±10µm
600 µm
1600 µm
1600 µm
500µm
500µm
∅ 315µm
600 µm
1600 µm
1600 µm
500µm
500µm
∅ 315µm
Pad in Cu 18
μm with Flash NiAu (6μm, 0.15μm)
150
μm min.
500
μm
500
μm
Φ=250μm
Φ=400μm
75µm min.
100
μm max.
Track
Solder mask opening
TS922IJ Footprint
Pad in Cu 18
μm with Flash NiAu (6μm, 0.15μm)
150
μm min.
500
μm
500
μm
Φ=250μm
Φ=400μm
75µm min.
100
μm max.
Track
Solder mask opening
Pad in Cu 18
μm with Flash NiAu (6μm, 0.15μm)
150
μm min.
500
μm
500
μm
Φ=250μm
Φ=400μm
75µm min.
100
μm max.
Track
Solder mask opening
TS922IJ Footprint


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