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SST32HF324C-70-4C-LBK Datasheet(PDF) 2 Page - Silicon Storage Technology, Inc

Part # SST32HF324C-70-4C-LBK
Description  Multi-Purpose Flash Plus SRAM ComboMemory
Download  28 Pages
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Manufacturer  SST [Silicon Storage Technology, Inc]
Direct Link  http://www.sst.com/
Logo SST - Silicon Storage Technology, Inc

SST32HF324C-70-4C-LBK Datasheet(HTML) 2 Page - Silicon Storage Technology, Inc

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Preliminary Specifications
Multi-Purpose Flash Plus + SRAM ComboMemory
SST32HF324C
©2005 Silicon Storage Technology, Inc.
S71267-02-000
9/05
SuperFlash technology provides fixed Erase and Program
times independent of the number of Erase/Program cycles
that have occurred. Therefore the system software or hard-
ware does not have to be modified or de-rated as is neces-
sary with alternative flash technologies, whose Erase and
Program times increase with accumulated Erase/Program
cycles.
Device Operation
The ComboMemory uses BES# and BEF# to control oper-
ation of either the SRAM or the flash memory bank. When
BES# is low, the SRAM Bank is activated for Read and
Write operation. When BEF# is low the flash bank is acti-
vated for Read, Program or Erase operation. BES# and
BEF# cannot be at low level at the same time. If BES# and
BEF# are both asserted to low level bus contention will
result and the device may suffer permanent damage.
All address, data, and control lines are shared by SRAM
Bank and flash bank which minimizes power consumption
and loading. The device goes into standby when both bank
enables are high.
Concurrent Read/Write Operation
The SST32HF324C provide the unique benefit of being
able to read from or write to SRAM, while simultaneously
erasing or programming the flash. This allows data alter-
ation code to be executed from SRAM, while altering the
data in flash. See Figure 22 for a flowchart. The following
table lists all valid states.
The device will ignore all SDP commands when an Erase
or Program operation is in progress. Note that Product
Identification commands use SDP; therefore, these com-
mands will also be ignored while an Erase or Program
operation is in progress.
Flash Read Operation
The Read operation of the SST32HF324C devices is con-
trolled by BEF# and OE#. Both have to be low, with WE#
high, for the system to obtain data from the outputs. BEF#
is used for flash memory bank selection. When BEF# is
high, the chip is deselected and only standby power is
consumed. OE# is the output control and is used to gate
data from the output pins. The data bus is in high imped-
ance state when OE# is high. Refer to Figure 5 for further
details.
Flash Word-Program Operation
The flash memory bank of the SST32HF324C devices is
programmed on a word-by-word basis. Before Program
operations, the memory must be erased first. The Program
operation consists of three steps. The first step is the three-
byte load sequence for Software Data Protection. The sec-
ond step is to load word address and word data. During the
Word-Program operation, the addresses are latched on the
falling edge of either BEF# or WE#, whichever occurs last.
The data is latched on the rising edge of either BEF# or
WE#, whichever occurs last. The third step is the internal
Program operation which is initiated after the rising edge of
the fourth WE# or BEF#, whichever occurs first. The Pro-
gram operation, once initiated, will be completed, within 10
µs. See Figures 6 and 7 for WE# and BEF# controlled Pro-
gram operation timing diagrams and Figure 18 for flow-
charts. During the Program operation, the only valid flash
Read operations are Data# Polling and Toggle Bit. During
the internal Program operation, the host is free to perform
additional tasks. Any SDP commands loaded during the
internal Program operation will be ignored.
Flash Sector-/Block-Erase Operation
The Flash Sector/Block-Erase operation allows the system
to erase the device on a sector-by-sector (or block-by-
block) basis. The SST32HF324C offer both Sector-Erase
and Block-Erase mode. The sector architecture is based
on uniform sector size of 2 KWord. The Block-Erase mode
is based on uniform block size of 32 KWord. The Sector-
Erase operation is initiated by executing a six-byte com-
mand sequence with Sector-Erase command (30H) and
sector address (SA) in the last bus cycle. The address lines
AMS-A11 are used to determine the sector address. The
Block-Erase operation is initiated by executing a six-byte
command sequence with Block-Erase command (50H)
and block address (BA) in the last bus cycle. The address
lines AMS-A15 are used to determine the block address.
The sector or block address is latched on the falling edge of
the sixth WE# pulse, while the command (30H or 50H) is
latched on the rising edge of the sixth WE# pulse. The
internal Erase operation begins after the sixth WE# pulse.
The End-of-Erase operation can be determined using
either Data# Polling or Toggle Bit methods. See Figures 11
and 12 for timing waveforms. Any commands issued during
the Sector- or Block-Erase operation are ignored.
CONCURRENT READ/WRITE STATE TABLE
Flash
SRAM
Program/Erase
Read
Program/Erase
Write


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