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MGA-71543-BLKG Datasheet(PDF) 17 Page - Agilent(Hewlett-Packard) |
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MGA-71543-BLKG Datasheet(HTML) 17 Page - Agilent(Hewlett-Packard) |
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17 / 24 page  17 mounting surface, i.e., the tem- perature at the PCB mounting pads. The primary heat path from the RFIC chip to the system heatsink is by means of conduc- tion through the package leads and ground vias to the ground plane of the PCB. Grounding Consideration in PCB Layout The MGA-71543 requires careful attention during grounding. Any device with gain can be made to oscillate if feedback is added. Since poor grounding adds series feedback, it can cause the device to oscillate. Poor grounding is one of the most common causes of oscillation in RF components. Careful attention should be used when RF bypassing the ground terminals when the device is biased using the source resistor method. Package Footprint The PCB pad print for the minia- ture, 4-lead SOT-343 (SC70) package is shown in Figure 12. 1.30 0.051 0.60 0.024 .090 0.035 Dimensions in inches mm 1.15 0.045 2.00 0.079 1.00 0.039 Figure 12. Recommended PCB Pad Layout for Agilent’s SC70 4L/SOT-343 Products. The layout is shown with a footprint of the MGA-71543 superimposed on the PCB pads for reference. RF bypass For layouts using the source resistor method of biasing, both of the ground terminals of the MGA-71543 must be well bypassed to maintain device stability. Beginning with the package pad print in Figure 12, and RF layout similar to the one shown in Figure 13 is a good starting point for using the MGA-71543 with capacitor-bypassed ground terminals. It is a best practice to use multiple vias to minimize overall ground path inductance. 71 Size 0402 recommended for the bypass capacitors Figure 13. Layout for RF Bypass. PCB Materials 0.031 inches thick of FR-4 or G-10 type dielectric materials are typical choices for most low cost wireless applications using single layer printed boards. As an alternative, a Getek material with a multilayer printed circuit board can be used for a smaller size board, where: 1st layer: RF routing layer 2nd layer: Ground layer 3rd layer: Power (DC) routing layer 4th layer: Other RF routing layer The spacing between the layers is as follows: Between the 1st and 2nd: 0.005" Between the 2nd and 3rd: 0.020" Between the 3rd and 4th: 0.005" LNA Application In the following sections the LNA design is described in a more general way. Sample evaluation boards for 1900 MHz and 800 MHz are shown in a table (Table 1) and the appropriate board diagram is shown (Figures 22 and 23). A second smaller size board is also shown (Figures 25 and 26) with the corresponding table (Table 2). The smaller board is an example of reducing the size of the layout, more suitable for handset manu- facturers. For low noise amplifier application, the LNA is typically biased 6 to 20 mA. The MGA-71543 is a conditionally stable device, therefore, the proper input and output loads must be presented in addition to properly RF grounding the device. Please refer to the stability section for tips on preventing oscillation. The LNA can be switched ON or OFF by a simply varying the resistor to its ground leads as described in previous sections. Matching Networks for the LNA LNA Γin ΓL Γs or Γopt Γopt 50 Ω 50 Ω Output Match Input Match Figure 14. Input and Output Matching Terminology. The input matching network determines the noise figure and return loss (S11) of our amplifier. The output-matching network determines the IP3 and output return loss (S22). Furthermore, both input and output matching networks influence the gain. The best gain (Maximum Available Gain-MAG) and lowest input return loss is obtained when both the input and output are conju- |
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