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TLV2262AMJGB Datasheet(PDF) 2 Page - Texas Instruments |
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TLV2262AMJGB Datasheet(HTML) 2 Page - Texas Instruments |
2 / 53 page TLV225x, TLV225xA Advanced LinCMOS RAILTORAIL VERY LOW POWER OPERATIONAL AMPLIFIERS SLOS185D − FEBRUARY 1997 − REVISED AUGUST 2006 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2252 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25 °C SMALL OUTLINE† (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP‡ (PW) CERAMIC FLATPACK (U) −40 °C to 125°C 850 µV TLV2252AID — — TLV2252AIP TLV2252AIPWLE — −40 °C to 125°C 850 µV 1500 µV TLV2252AID TLV2252ID — — — — TLV2252AIP TLV2252IP TLV2252AIPWLE — — — −40 °C to 125°C 850 µV TLV2252AQD — — — — — −40 °C to 125°C 850 µV 1500 µV TLV2252AQD TLV2252QD — — — — — — — — — — −55 °C to 125°C 850 µV 1500 µV — — TLV2252AMFK TLV2252MFK TLV2252AMJG TLV2252MJG — — — — TLV2252AMU TLV2252MU † The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2252CDR). ‡ The PW package is available only left-end taped and reeled. § Chips are tested at 25°C. TLV2254 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25 °C SMALL OUTLINE† (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP‡ (PW) CERAMIC FLATPACK (W) −40 °C to 125°C 850 µV TLV2254AID — — TLV2254AIN TLV2254AIPWLE — −40 °C to 125°C 850 µV 1500 µV TLV2254AID TLV2254ID — — — — TLV2254AIN TLV2254IN TLV2254AIPWLE — — — −40 °C to 125°C 850 µV TLV2254AQD — — — — — −40 °C to 125°C 850 µV 1500 µV TLV2254AQD TLV2254QD — — — — — — — — — — −55 °C to 125°C 850 µV 1500 µV — — TLV2254AMFK TLV2254MFK TLV2254AMJ TLV2254MJ — — — — TLV2254AMW TLV2254MW † The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2254CDR). ‡ The PW package is available only left-end taped and reeled. § Chips are tested at 25°C. |
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