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TLV255X Datasheet(PDF) 2 Page - Texas Instruments

Part No. TLV255X
Description  ADVANCED LINCMOS RAIL-TO-RAIL VERY LOW-POWER OPERATIONAL AMPLIFIERS
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV255X Datasheet(HTML) 2 Page - Texas Instruments

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TLV225x, TLV225xA
Advanced LinCMOS RAILTORAIL
VERY LOW POWER OPERATIONAL AMPLIFIERS
SLOS185D − FEBRUARY 1997 − REVISED AUGUST 2006
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2252 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP‡
(PW)
CERAMIC
FLATPACK
(U)
−40
°C to 125°C
850
µV
TLV2252AID
TLV2252AIP
TLV2252AIPWLE
−40
°C to 125°C
850
µV
1500
µV
TLV2252AID
TLV2252ID
TLV2252AIP
TLV2252IP
TLV2252AIPWLE
−40
°C to 125°C
850
µV
TLV2252AQD
−40
°C to 125°C
850
µV
1500
µV
TLV2252AQD
TLV2252QD
−55
°C to 125°C
850
µV
1500
µV
TLV2252AMFK
TLV2252MFK
TLV2252AMJG
TLV2252MJG
TLV2252AMU
TLV2252MU
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2252CDR).
‡ The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.
TLV2254 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP‡
(PW)
CERAMIC
FLATPACK
(W)
−40
°C to 125°C
850
µV
TLV2254AID
TLV2254AIN
TLV2254AIPWLE
−40
°C to 125°C
850
µV
1500
µV
TLV2254AID
TLV2254ID
TLV2254AIN
TLV2254IN
TLV2254AIPWLE
−40
°C to 125°C
850
µV
TLV2254AQD
−40
°C to 125°C
850
µV
1500
µV
TLV2254AQD
TLV2254QD
−55
°C to 125°C
850
µV
1500
µV
TLV2254AMFK
TLV2254MFK
TLV2254AMJ
TLV2254MJ
TLV2254AMW
TLV2254MW
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2254CDR).
‡ The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.


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