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UCLAMP3301H Datasheet(PDF) 4 Page - Semtech Corporation |
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UCLAMP3301H Datasheet(HTML) 4 Page - Semtech Corporation |
4 / 6 page 4 2004 Semtech Corp. www.semtech.com PROTECTION PRODUCTS uClamp3301H Device Connection Options The µclamp3301H is designed to protect one I/O, or power supply line. It will present a high impedance to the protected line up to 3.3 volts. It will “turn on” when the line voltage exceeds 3.5 volts. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. EPD TVS Characteristics These devices are constructed using Semtech’s proprietary EPD technology. The structure of the EPD TVS is vastly different from the traditional pn-junction devices. At voltages below 5V, high leakage current and junction capacitance render conventional ava- lanche technology impractical for most applications. However, by utilizing the EPD technology, these devices can effectively operate at 3.3V while maintaining excellent electrical characteristics. The EPD TVS employs a complex nppn structure in contrast to the pn structure normally found in tradi- tional silicon-avalanche TVS diodes. The EPD mecha- nism is achieved by engineering the center region of the device such that the reverse biased junction does not avalanche, but will “punch-through” to a conduct- ing state. This structure results in a device with supe- rior DC electrical parameters at low voltages while maintaining the capability to absorb high transient currents. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Applications Information Device Schematic & Pin Configuration IPP ISB IPT IR VRWM V V PT VC V F I F SB EPD TVS IV Characteristic Curve |
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