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XPC850DECZT66B Datasheet(PDF) 8 Page - Motorola, Inc |
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XPC850DECZT66B Datasheet(HTML) 8 Page - Motorola, Inc |
8 / 68 page 8 MPC850 (Rev. A/B/C) Hardware Specifications MOTOROLA Part IV Thermal Characteristics Table 3 shows the thermal characteristics for the MPC850. Table 4 provides power dissipation information. Table 5 provides the DC electrical characteristics for the MPC850. Table 3. Thermal Characteristics Characteristic Symbol Value Unit Thermal resistance for BGA 1 1 For more information on the design of thermal vias on multilayer boards and BGA layout considerations in general, refer to AN-1231/D, Plastic Ball Grid Array Application Note available from your local Motorola sales office. θ JA 40 2 2 Assumes natural convection and a single layer board (no thermal vias). °C/W θ JA 31 3 3 Assumes natural convection, a multilayer board with thermal vias4, 1 watt MPC850 dissipation, and a board temperature rise of 20 °C above ambient. °C/W θ JA 24 4 4 Assumes natural convection, a multilayer board with thermal vias4, 1 watt MPC850 dissipation, and a board temperature rise of 13 °C above ambient. TJ = TA + (PD •θJA) PD = (VDD • IDD) + PI/O where: PI/O is the power dissipation on pins °C/W Thermal Resistance for BGA (junction-to-case) θ JC 8 °C/W Table 4. Power Dissipation (PD) Characteristic Frequency (MHz) Typical 1 1 Typical power dissipation is measured at 3.3V Maximum 2 2 Maximum power dissipation is measured at 3.65 V Unit Power Dissipation All Revisions (1:1) Mode 33 TBD 515 mW 40 TBD 590 mW 50 TBD 725 mW Table 5. DC Electrical Specifications Characteristic Symbol Min Max Unit Operating voltage at 40 MHz or less VDDH, VDDL, KAPWR, VDDSYN 3.0 3.6 V Operating voltage at 40 MHz or higher VDDH, VDDL, KAPWR, VDDSYN 3.135 3.465 V Input high voltage (address bus, data bus, EXTAL, EXTCLK, and all bus control/status signals) VIH 2.0 3.6 V Input high voltage (all general purpose I/O and peripheral pins) VIH 2.0 5.5 V |
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