Tape Dimensions

Unit: mm

Series

A

B

C

D

E

F

G

H

I

8432-03

81.1

4

1.75

3.5

1.75

2

1.15

0.25

8432-05

81.88

4

2.38

3.5

1.75

2

1.48

0.2

8432-08

82.73

4

2.88

3.5

1.75

2

2.33

0.2

Packaging Quantity

Unit: pcs

Packaging

Series

pcs/wheel

8432-03

4,000

8432-05

2,500

8432-08

2,000

WIRE WOUND

Ceramic Chip Inductor

8432 Series

ENVIRONMENTAL CHARACTERISTICS

Item

Specification

Test Method

1

Vibration

Appearance: No damage

L change: within

±10%

Q change: within

±30%

Test device shall be soldered on the substrate

Oscillation Frequency: 10 to 55 to 10Hz for 1min

Amplitude: 1.5mm

Time: 2 hrs for each axis (X, Y & Z), total 6 hrs

2

Resistance to

Soldering-teat

Appearance: No damage

Pre-heating: 150 ˚C, 1min

Solder Composition: Sn/Pb=63/67

Solder Temperature: 260

±5 ˚C

Immersion Time: 10

±1sec

3

Solderability

The electrodes shall be at

least 90% covered with new

solder coating

Pre-heating: 150 ˚C, 1min

Solder Composition: Sn/Pb=63/67

Solder Temperature: 230

±5 ˚C

Immersion Time: 4

±1sec

Item

Specification

Test Method

1

Temperature Cycle

One cycle:

Total: 100 cycles

Measured after exposure in the room condition for 24 hrs

2

Humidity Resistance

Temperature: 40

±2 ˚C

Relative Humidity: 90-95%

Time: 1000 hrs

Measured after exposure in the room condition for 24 hrs

3

High Temperature

Resistance

Temperature: -85

±3 ˚C

Relative Humidity: 20%

Time: 1000 hrs

Measured after exposure in the room condition for 24 hrs

4

Low Temperature

Resistance

Appearance: No damage

L change: within

±10%

Q change: within

±30%

Temperature: -25

±3 ˚C

Relative Humidity: 0%

Time: 1000 hrs

Measured after exposure in the room condition for 24 hrs

Step

Temperature (˚C)

Time (min)

1-25

±330

225

±23

385

±330

425

±23

An ISO 9001 Registered Company

229 Colonnade Road, Ottawa, Ontario, Canada K2E 7K3

Page 5 of 5

PACKAGING

Mechanical Performance

Environmental Performance