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OPA131PJ Datasheet(PDF) 11 Page - Texas Instruments |
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OPA131PJ Datasheet(HTML) 11 Page - Texas Instruments |
11 / 18 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) OPA131P OBSOLETE PDIP P 8 None Call TI Call TI OPA131PA OBSOLETE PDIP P 8 None Call TI Call TI OPA131PJ OBSOLETE PDIP P 8 None Call TI Call TI OPA131U ACTIVE SOIC D 8 100 None CU SNPB Level-2-220C-1 YEAR OPA131U/2K5 ACTIVE SOIC D 8 2500 None CU SNPB Level-2-220C-1 YEAR OPA131UA ACTIVE SOIC D 8 100 None CU SNPB Level-2-220C-1 YEAR OPA131UA/2K5 ACTIVE SOIC D 8 2500 None CU SNPB Level-3-235C-168 HR OPA131UJ ACTIVE SOIC D 8 100 None CU SNPB Level-3-235C-168 HR OPA131UJ/2K5 ACTIVE SOIC D 8 2500 None CU SNPB Level-3-235C-168 HR OPA2131PA OBSOLETE PDIP P 8 None Call TI Call TI OPA2131PJ OBSOLETE PDIP P 8 None Call TI Call TI OPA2131UA ACTIVE SOIC D 8 100 None CU SNPB Level-3-220C-168 HR OPA2131UA/2K5 ACTIVE SOIC D 8 2500 None CU SNPB Level-3-220C-168 HR OPA2131UJ ACTIVE SOIC D 8 100 None CU SNPB Level-3-220C-168 HR OPA2131UJ/2K5 ACTIVE SOIC D 8 2500 None CU SNPB Level-3-220C-168 HR OPA4131NA ACTIVE SOIC D 14 58 None CU SNPB Level-3-220C-168 HR OPA4131NJ ACTIVE SOIC D 14 58 None CU SNPB Level-3-235C-168 HR OPA4131PA ACTIVE PDIP N 14 25 None Call TI Level-NA-NA-NA OPA4131PJ ACTIVE PDIP N 14 25 None Call TI Level-NA-NA-NA OPA4131UA ACTIVE SOIC DW 16 48 None CU SNPB Level-3-260C-168 HR OPA4131UA/1K ACTIVE SOIC DW 16 1000 None CU SNPB Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. PACKAGE OPTION ADDENDUM www.ti.com 5-Jan-2005 Addendum-Page 1 |
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