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SY89875UMITR Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY89875UMITR Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 10 page 3 Precision Edge™ SY89875U Micrel Note 1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Note 3. Due to the limited drive capability use for input of the same package only. Note 4. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. Absolute Maximum Ratings(Note 1) Supply Voltage (V CC) .................................. –0.5V to +4.0V Input Voltage (V IN) .................................. –0.5V to VCC+0.3 ECL Output Current (I OUT) Continuous ......................................................... 50mA Surge ................................................................ 100mA Input Current IN, /IN (I IN) .......................................... ±50mA V T Current (IVT) ...................................................... ±100mA V REF-AC Sink/Source Current (IVREF-AC), Note 3 ....... ±2mA Lead Temperature (soldering 10 sec.) ...................... 220 °C Storage Temperature (T S) ....................... –65°C to +150°C Operating Ratings(Note 2) Supply Voltage (V CC) ........................................ +2.5V ±5% Ambient Temperature (T A) ......................... –40°C to +85°C Package Thermal Resistance MLF™ (θ JA) Still-Air ............................................................. 60 °C/W 500lfpm ............................................................ 54 °C/W MLF™ (ψ JB), Note 4 Junction-to-Board ............................................ 32 °C/W T A= –40°C to +85°C; Unless otherwise stated. Symbol Parameter Condition Min Typ Max Units V CC Power Supply 2.375 2.625 V I CC Power Supply Current No load, max. V CC 70 95 mA R IN Differential Input Resistance (IN, /IN) 80 100 120 Ω V IH Input High Voltage (IN, /IN) Note 3 0.1 – V CC+0.3 V V IL Input Low Voltage (IN, /IN) Note 3 –0.3 – V CC+0.2 V V IN Input Voltage Swing Note 4 – 1.8 V V DIFF_IN Differential Input Voltage Swing Note 5 0.1 – 3.6 V |I IN| Input Current (IN, /IN) Note 3 –– 45 mA V REF–AC Reference Voltage Note 6 V CC–1.525 VCC–1.425 VCC–1.325 V Note 1. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Note 2. Specification for packaged product only. Note 3. Due to the internal termination (see Figure 2a) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a combination of voltages that causes the input current to exceed the maximum limit! Note 4. See “Timing Diagram” for V IN definition. VIN (Max) is specified when VT is floating. Note 5. See “Typical Operating Characteristics” section for VDIFF definition. Note 6. Operating using V IN is limited to AC-coupled PECL or CML applications only. Connect directly to VT pin. DC ELECTRICAL CHARACTERISTICS(Notes 1, 2) |
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