RUE Product Data
Now that you have selected your RUE device, please review the
device’s characteristics in this section to verify that the device will
perform as required.
Electrical characteristics (20°C)
Initial
Post-trip
Max. time
resistance
resistance
Part
IH
IT
to trip (s)
Pd
R min.
R max.
R1 max .
Number
(A)
(A)
at 5 x IH
(W)
(
Ω )( Ω )( Ω )
RUE090
0.90
1.80
5.9
0.6
0.070
0.12
0.22
RUE110
1.10
2.20
6.6
0.7
0.050
0.10
0.17
RUE135
1.35
2.70
7.3
0.8
0.040
0.08
0.13
RUE160
1.60
3.20
8.0
0.9
0.030
0.07
0.11
RUE185
1.85
3.70
8.7
1.0
0.030
0.06
0.09
RUE250
2.50
5.00
10.3
1.2
0.020
0.04
0.07
RUE300
3.00
6.00
10.8
2.0
0.020
0.05
0.08
RUE400
4.00
8.00
12.7
2.5
0.010
0.03
0.05
RUE500
5.00
10.00
14.5
3.0
0.010
0.03
0.05
RUE600
6.00
12.00
16.0
3.5
0.005
0.02
0.04
RUE700
7.00
14.00
17.5
3.8
0.005
0.02
0.03
RUE800
8.00
16.00
18.8
4.0
0.005
0.02
0.02
RUE900
9.00
18.00
20.0*
4.2
0.005
0.01
0.02
IH = Hold current—maximum current at which the device will not trip at 20°C.
IT = Trip current—minimum current at which the device will always trip at 20°C.
Pd = Typical power dissipation—typical amount of power dissipated by the device when in tripped state in 20°C still air.
R min. = Minimum device resistance at 20°C prior to tripping.
R max. = Maximum device resistance at 20°C prior to tripping.
R1 max. = Maximum device resistance at 20°C measured 1 hour post trip.
* Device tested at 40 A.
Physical characteristics
Lead material
RUE090–250: Tin lead-plated copper-clad steel, 24 AWG,
∅ 0.51 mm/0.020 in
RUE300–900: Tin lead-plated copper, 20 AWG,
∅ 0.81 mm/0.032 in
Soldering characteristics
Solderability per MIL-STD-202, Method 208E
Solder heat withstand per MIL-STD-202, Method 210, Condition B
Insulating material
Cured, flame-retardant epoxy polymer; meets UL 94V-O
requirements
Note: Devices are not designed to be placed through a reflow process.
146 RUE Devices
Raychem Circuit Protection Devices
RUE
Radial Leaded
4
RUE(7)
1/15/99 11:28 AM
Page 146
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