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NJL6201R-1 Datasheet(PDF) 4 Page - New Japan Radio

Part No. NJL6201R-1
Description  HIGH SPEED PIN PHOTO DIODE
Download  6 Pages
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Maker  NJRC [New Japan Radio]
Homepage  http://www.njr.co.jp/index_e.htm
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NJL6201R-1 Datasheet(HTML) 4 Page - New Japan Radio

   
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NJL6201R-1
- 4 -
Ver.2005-01-20
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
- Heated condition of plastic package.
Lower than 260
°C of maximum surface temperature
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
Soldering to be done within twice under this condition.
2) Reflow Method (In case of infrared heating)
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
temperature will be higher than lead itself.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method ( VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in deaeration
packaging. So that mount the device as short as possible after opening the envelope.
a
b
c
g
e
150
°C
260
°C
Room
Temp.
f
180
°C
230
°C
220
°C
d
a : Temperature ramping rate
: 1 to 4
°C/s
b : Pre-heating temperature
time
: 150 to 180
°C
: 60 to 120s
c : Temperature ramping rate
: 1 to 4
°C /s
d : 220
°C or higher time
: Shorter than 60s
e : 230
°C or higher time
: Shorter than 40s
f : Peak temperature
: Lower than 260
°C
g : Temperature ramping rate
: 1 to 6
°C /s
The temperature indicates at the surface of mold
package


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