NJL6201R-1

- 4 -

Ver.2005-01-20

PRECAUTION FOR HANDLING

1. Soldering to actual circuit board

Soldering condition

- Heated condition of plastic package.

Lower than 260

°C of maximum surface temperature

Soldering Method

1) Reflow Method

Recommended temperature profile of its method.

Soldering to be done within twice under this condition.

2) Reflow Method (In case of infrared heating)

- Temperature profile : Same to the above

- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface

temperature will be higher than lead itself.

3) The other method

Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method ( VPS).

If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.

It is necessary to solder in short time as soon as possible.

2. Cleaning

Avoid washing of the device after soldering by reflow method.

3. Attention in handling

1) Treat not to touch the lens surface.

2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.

4. Storage

In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in deaeration

packaging. So that mount the device as short as possible after opening the envelope.

a

b

c

g

e

150

°C

260

°C

Room

Temp.

f

180

°C

230

°C

220

°C

d

a : Temperature ramping rate

: 1 to 4

°C/s

b : Pre-heating temperature

time

: 150 to 180

°C

: 60 to 120s

c : Temperature ramping rate

: 1 to 4

°C /s

d : 220

°C or higher time

: Shorter than 60s

e : 230

°C or higher time

: Shorter than 40s

f : Peak temperature

: Lower than 260

°C

g : Temperature ramping rate

: 1 to 6

°C /s

The temperature indicates at the surface of mold

package