Electronic Components Datasheet Search |
|
ADA4417-3 Datasheet(PDF) 5 Page - Analog Devices |
|
ADA4417-3 Datasheet(HTML) 5 Page - Analog Devices |
5 / 16 page ADA4417-3 Rev. 0 | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Supply Voltage 5.5 V Power Dissipation See Figure 2 Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Package Type θJA Unit 10-Lead MSOP 130 °C/W Maximum Power Dissipation The maximum safe power dissipation in the ADA4417-3 package is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance of the ADA4417-3. Exceeding a junction temperature of 175°C for an extended period can result in changes in the silicon devices potentially causing failure. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power is the supply voltage (VS) times the quiescent current (IS). Assuming the load (RL) is midsupply, then the total drive power is VS/2 × IOUT some of which is dissipated in the package and some in the load (VOUT × IOUT). RMS output voltages should be considered. If RL is referenced to GND, the total power is VS × IOUT. Airflow increases heat dissipation, effectively reducing θJA. In addition, more metal directly in contact with the package leads from metal traces, through holes, ground, and power planes reduce the θJA. Figure 2 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 10-lead MSOP (130°C/W) on a JEDEC standard 4-layer board. θJA values are approximate. 2.0 1.5 1.0 0.5 0 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 AMBIENT TEMPERATURE (°C) Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
Similar Part No. - ADA4417-3 |
|
Similar Description - ADA4417-3 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |